Printed circuit board (PCB) materials

Glass-based panels can be used at temperatures up to 150 ℃ to 250 ℃. The optional media materials are:

• FR4, dielectric constant ε0 of 4.6
• Epoxy material, dielectric constant ε0 is 3.9;
• Polyimide, dielectric constant ε0 is 4.5.

In addition, PTFE-based materials have the lowest dielectric constant and operate at temperatures up to 300 ℃, where

• PTFE, dielectric constant ε0=2.1;
• thermally solid PTFE, dielectric constant ε0=2.8;
• Glass-fiber PTFE, dielectric constant ε0=2.4;

Contemporary PCB processing technology can make 40 or more layers of circuit boards, and through the so-called Vias (Vias) to establish inter-layer connection.

Unfortunately, the typical thermal conductivity of most printed circuit board plates is less than 0.5w/m℃ and very poor.

This digest is from "RF circuit design-theory and application"

Printed circuit board (PCB) materials