What about cob (chip on board )? Introduce the evolution history of cob

Cob (chip on board) is already a mature technology in e-commerce, but the average team lead is not familiar with its programming, maybe it is because it uses some wire bond's physical electrical circuit (IC) Sealing technology, as a result, many finished products or foundry engineers of industrial electronic circuit boards are eager to find related technical personnel.

In the past, most cob products were only used in some low-cost consumer products. The smaller their sub-products, more and more companies begin to test their cob processes to their products. After all, the space available on the e-commerce board is limited in size, the CoB program can use a smaller space than the IC. Maybe the technical skills used for optimization are too good, so some people have come back to their head to test the COB program.

Now, I have reorganized the experience of the CoB architecture and operations many years ago. On the one hand, I want to remind myself of this manual, and on the other hand, I want to provide an exam.Some information may not be the latest, which is provided for your examination..

Evolution History of IC, COB, and flip chip (COG)

The lower part helps you understand the evolution history of the electronic sub-chip envelope from IC Encapsulation → cob → flip chip (COG), the smaller the size. Cob can only be said to be a medium-time product of current technology. In addition, the CSP (chip scare package) should be a program between cob and flip chip! It's a bit tricky.

 

 

Cob said it was just to transplant the wire bonding and caplu operations of the IC envelope to the E-board, that is to say, it refers to the leadframeThe raw wafer (die) is glued to the PCB, and the original bonding to the wire) change the solder mask to the PCB, and then replace the original mold seal with epoxy points to overwrite the crystal mask and temperature mask, cob can save the cut Molding (triming & form) and printing (marking) of the original ICF seal, or reduce the use of the IC seal pipe, so basically, its program will be cheaper than the IC-based program.

Because it is cheap, COB's technology in the early days only used anti-credit phones that were less reliable than traditional computers, in everyday necessities such as toys, computators, small Indicator devices, and shopping malls, as these products are cheap enough to make your use of them, you will need to buy a new one. Therefore, in the early stages, most of the CoB engineering processes of the platform were developed by the IC sealing staff. The customer was ready to work and there was no environmental control, we often make people think that the quality of CoB is so insecure.

However, in this development, more and more customers are looking at its small size, and the product is short and thin, in recent years, the use of cob has become increasingly complex. For example, many products with short requirements, such as mobile phones and cameras, have been imported into Cob.

COB has another marketing point so that some vendors love it. Due to the need for "sealing", the common CoB will seal all external connections to the oxygen generator resin (epoxy, hackers who like to crack other designs may need more time to crack this feature, connections have been upgraded to anti-DDoS security. (※This is determined by the amount of time spent and the amount of money spent on Anti-DDoS security. The more time spent and the more money spent, wait for the token to be higher)

 

What about cob (chip on board )? Introduce the evolution history of cob