Science: How many chips can a piece of wafer be cut?

What is the number of wafers that can be cut by a piece of wafer? This depends on the size of the die and the size of the wafer and yield.

At present the industry so-called 6-inch, 12-inch or 18-inch wafer is actually the wafer diameter abbreviation, but this inch is the estimate value. The actual wafer diameter is divided into 150mm,300mm and 450mm of these three kinds, and 12 inches is about 305mm, in order to call convenient so called 12-inch wafer.

International FAB Factory general Calculation formula:

Smart readers must have found the formula:π* (wafer diameter/2) squared is not a round area of the equation? And then the formulation of a simple word will become:

X is the so-called Wafer can cut the number of wafers (Dpw:die per wafer).

So the test of your ability to calculate YO!

Assuming that the 12-inch wafer cost $5000 per piece, then Nvidia's latest masterpiece GT200 wafer size of 576 square millimeters, in the case of yield 50%, the average cost per dollar is how much?
Answer: usd.87.72

Science: The difference between wafer die chip

Let's start with a complete wafer (Wafer):

a complete wafer

noun explanation : wafer is the wafer shown in the picture, composed of pure silicon (SI). Generally divided into 6-inch, 8-inch, 12-inch specifications ranging from the chip is based on the production of this wafer. A small piece on the wafer, is a wafer wafer, the scientific name die, the package becomes a particle. A piece of wafer,wafer containing NAND flash wafers is first cut, then tested, to remove intact, stable, and full-capacity die, encapsulating the usual NAND flash chip (CHIP). Then, the remaining on the wafer, or is unstable, or part of the damage so insufficient capacity, or is completely damaged. The original quality assurance, the die will be declared dead, strictly defined as scrap disposal.

the relationship between die and wafer

Quality qualified die cutting down, the original wafer has become the appearance, is to pick the remaining downgrade Flash Wafer.

Wafer after the filter

These remnants of die, in fact, the quality of the wafer is not qualified. The part that is removed, that is, the black part, is qualified die, will be produced by the original packaging for the production of NAND particles, and unqualified parts, that is, the left part of the picture as waste disposal.

Wafer size development history (estimated)

Inventory 2015 global wafer foundry Top 30

The life course of an integrated circuit chip is the process of sand-forming gold: chip company design chip-chip generation factory production chip-seal test factory for packaging testing-the machine to purchase chips for machine production.

Chip suppliers are generally divided into two categories: a class called IDM, popular understanding is set chip design, manufacturing, packaging and testing a number of industrial chain in one enterprise. Some even have their own downstream machine links, such as Intel, Samsung, IBM is a typical IDM enterprise.

another class called fabless, is no chip processing plant chip supplier, fabless own design and development and promotion of sales chip, and production-related business outsourcing to professional manufacturers, such as Qualcomm, Bo Tong, MediaTek, Spreadtrum and so on.

Corresponding to the fabless is foundry (wafer foundry) and sealing plant, the main undertaking fabless production and packaging testing tasks, the typical foundry (wafer foundry) such as TSMC, GlobalFoundries, SMIC, TSU, etc., sealed the plant has a day moonlight, Jiangsu long electricity.

several large wafer-generation industries in the continental context

UMC in Suzhou, China and the ship factory 8-inch crystal full Moon production capacity of about 670,000 tablets, 2016 no further expansion plan. UMC to invest in China IC design manufacturers in the way, 5 years since 2015 will invest $131.4 billion, in Xiamen to build 12-inch wafer factory, the total investment scale of 6.2 billion U.S. dollars, has commenced in March 2015. At the beginning of the 40/55 nm process into the market, the future to transfer to 28 nm target. Xiamen Factory is expected to end 2016 to 2017 early stage production, the initial monthly capacity of 120,000 tablets, the future will be expanded as the situation. UMC is currently a foundry manufacturer, the fastest-growing company in China.

SMIC currently has a total of 3 8-inch wafer factories in Shanghai, Tianjin and Shenzhen respectively. Among them, Shanghai and Tianjin 8-inch factory monthly capacity of about 13.14 million pieces, Shenzhen plant is expected to start production in the fourth quarter of this year. In 2016, SMIC's 8-inch wafer capacity can reach 15.16 million tablets per month. Its 12-inch factory is located in Shanghai and Beijing, the monthly production capacity of about 50,000 pieces, 2016 Beijing plant intends to increase about 10,000 monthly capacity. SMIC's future can successfully break through the 28nm process bottleneck, will be the operation can be a higher point of observation.

TSMC has a monthly capacity of about 10.11 million tablets in the 8-inch wafer factory in Songjiang, Shanghai, China. The need to set up a 12-inch wafer factory in China is currently being evaluated internally. Once set up plant, in the consideration of plant progress and market demand, at least at the beginning of 28 nm process as a starting point.

Samsung currently has only one 12-inch wafer fab in China to produce NAND flash products. Considering its wafer foundry capacity and main customer base, there is no plan to build a foundry in China for 1-2 years.

Source: Semiconductor Observation

Science: How many chips can a piece of wafer be cut?