View industry changes from bus isolation Products

Starting last year, major IC players have been constantly improving their bus isolation product lines, adi, NXP, Ti, linear, exar and so on all have released magnetic or Optical Isolation RS232, 485, can and other isolation chips. The sensitivity of these vendors to the market is always well prepared three years before large-scale application, from product positioning, R & D, testing, market promotion to after-sales services. From the current layout, we can see the reason 1: The bus environment of the industrial control site has become increasingly complex, and it is difficult to continue using the original chip and isolation module, the market demand is here; reason 2: the continuous progress of technology and technology gives IC better integration capabilities, especially the integration capability of Multi-signal hybrid. Because the IC of some manufacturers is actually achieved by MCP, it can be achieved on a silicon chip, and there is no need for a second chip. If it cannot be done, try to make the MCP as much as possible.

You can think about the new issues derived from this:

1. Why is the industrial control fieldbus environment worse?

2. What are the further requirements or expectations of industrial control fieldbus in terms of speed?

3. How can we select an isolated product suitable for each manufacturer's product line?

The only thing in the world that remains unchanged is constant changes!