Lian Hua electronic new generation 80 nanometer small size screen drive chip

The new generation of 80 nm small size screen drive chip (SDDI) manufacturing process featuring the most competitive SRAM storage unit in the wafer industry is announced. This low-power cutting-edge SRAM solution uses advanced design rules to reduce the storage unit size to 0.714 square microns, will be more than the existing 80 NM SDDI manufacturing process used in the general 0.81 square microns much more miniature, so that smart phones to achieve a smaller wafer size HD720/WXGA high-definition. This process is now ready for production, and with a number of major customers for HD720/WXGA quality of intelligent mobile phone products.

"With the rapid rise of intelligent mobile phones, Xu Yau Electronics has been the leader in special technology development, enabling our customers to continue to innovate and promote more powerful products," said the senior director of the 12-inch Special technology Development Division. The existing 80 nm and the upcoming 55 nano-SDDI manufacturing process will help existing or new customers with the introduction of lower power consumption and higher-quality cutting-edge smartphone screen driver chips. ”

Unilever Electronics has shipped more than 300 million sddi wafers on the 0.13 Micron manufacturing platform, using the mainstream smartphone with WVGA and qHD quality, and the new generation of 80 NM has continued and stabilized the leading position of Unilever electronics in the global Sddi wafer industry. In addition to the 0.13 micron and 80 nm SDDI manufacturing technology, Unilever is also targeting the FULL-HD screen of the second generation of intelligent mobile phones, the industry's first 55 nm SDDI manufacturing process, will be open to accept customers this quarter Sddi wafer design and development.