Ni releases new NI pxi/pxie-2543 solid-state RF multiplex

News Essentials ni pxi/pxie-2543 solid-state switch modules are able to route radio frequency signals up to 6.6 GHz with faster switching and unlimited mechanical life cycles. • For many large-scale production test applications, including semiconductor and mobile terminal testing, the new RF switch not only increases the test throughput but also ensures long-term measurement repeatability.   • The switch module further expands the card family of NI PXI modular instrument to help RF engineers face the latest challenges. Electronic enthusiasts Network-201 ...

Ramtron Elevator Cab Produkttechnik Thermal Printer series performance

World-leading non-volatile ferroelectric random access memory (F-RAM) and integrated semiconductor product developers and suppliers Ramtron Analysys Corporation (Ramtron) and German cab Produkttechnik GmbH & Co Kg announces that the Ramtron fm31l278 F-ram Processor Companion brings a superior advantage to users of the CAB's latest EOS thermal label Printer series. Ramtron's 256,000-digit ...

The United States of America (Tektronix) to Sentry Edge II upgrade RF monitoring Technology

Broadcast video testing, monitoring and analysis solution provider Tektronix announced the launch of Sentry Edge II, this is the Tektronix Sentry Video Quality Monitor series of the latest products.   Sentry Edge II detects RF modulation and transmission stream errors caused by device errors or failures, and with Sentry Edge II, the video service provider (VSP) can now access the information needed to proactively monitor the RF before the problem has affected the user. ...

Sitime was named North America's fastest-growing semiconductor company

Sitime, an analog semiconductor company Sitime Corporation, became the fastest-growing semiconductor company in North America and ranked 38th in the 2012 Deloitte (Deloitte) rating for High-tech, Gaocheng-long 500. The top 500 Deloitte is the fastest-growing technology company in North America for Media, telecommunications, life sciences and clean technologies. The standard for this award is based on a year-on-year increase in revenue from 2007-2011. During this period, Sitime Company's income increased ...

Lian Hua electronic new generation 80 nanometer small size screen drive chip

The new generation of 80 nm small size screen drive chip (SDDI) manufacturing process featuring the most competitive SRAM storage unit in the wafer industry is announced. This low-power cutting-edge SRAM solution uses advanced design rules to reduce the storage unit size to 0.714 square microns, will be more than the existing 80 NM SDDI manufacturing process used in the general 0.81 square microns much more miniature, so that smart phones to achieve a smaller wafer size HD720/WXGA high-definition. This process is now ready for production, and with several major customer pins ...

TDK to break the single plate density limit new technology will be able to make super large capacity hard drive

Electronic enthusiasts Network Core tip: Although the traditional hard disk in the speed and thickness is difficult to compete with SSD, but this old friend is still to provide price, capacity and speed of the three have the best choice.   On the occasion of the Japanese CEATEC exhibition, TDK only changed the magnetic head and disk material can significantly increase the density of more than 1.5 TB per square inch of technology, which indicates that 2.5 "notebook hard disk capacity will be up to 1 tb;3.5" desktop hard disk can reach 2 TB of single disk capacity. ...

St to launch high stability real time clock chip for smart meter

The Italian-French semiconductor (ST) offers a real-time clock wafer with low power consumption, high precision temperature compensation, new product lock-in applications that require stability and precise pulse functions, including electronic watches, medical devices and industrial systems. Under the normal operation of temperature compensation function, the typical power consumption is only the 0.8µa,m41tc8025 single chip real-time clock in the market at the same time the lowest power consumption, help reduce the working cost of the meter, prolong the service life of battery-powered equipment. Temperature compensation in the ambient temperature range of the specified 40°c to +85°c ...

Tensilica authorizes Fujitsu to design new generation mobile phone baseband

Tensilica authorized Fujitsu to carry out a new generation of mobile phone baseband design Tensilica recently announced that it is authorized to Fujitsu Xtensa, Japan, to configure the processor for the new generation of mobile phone baseband design. Tensilica CEO Jack Guedj said: "As Japan's leading mobile phone manufacturers of Fujitsu chose Tensilica, we are deeply honored." The Xtensa processor will help Fujitsu's design team complete innovative research and development and reduce design risk faster. Tensilica Company Xtens ...

Semiconductor display: Promoting the integration of industrial connotation

Over the past 15 years, there have been two debates in the field of display. Once before and after 2000, the color Picture tube (CRT) industry is facing the substitution crisis, the next mainstream direction is the plasma display (PDP) or the thin film transistor liquid crystal display (TFT-LCD)? There are very different voices in the industry. After more than 10 years of development, TFT-LCD has become the absolute mainstream of the display field. With the development of TFT-LCD and Electroluminescence (EL) technology, active organic light-emitting display (AMOLED) has been industrialized. In addition, the flexible display (flexible displa ...

Toshiba Semiconductor plant to rush for holiday, semiconductor demand back to temperature?

Toshiba (Toshiba), the world's 2nd-largest NAND flash memory (Flash Memory) maker, recently announced that its semiconductor plant in Japan will work overtime during the New Year's Day holiday later this year as semiconductor demand returns to temperature.   Toshiba said the Himeji Semiconductor plant, which shut down for 8 days from last year's New Year holiday, will not be shut down for production this year, and the number of downtime for Oita's New Year's Day holiday will be halved from 6 days last year to 3 days. Toshiba Himeji Semiconductor Factory mainly produces motor PC power control chip, Oita Factory main production ...

Major manufacturers to develop, chip-solid stacking technology application is imminent

TSV Stereo Stacking technology has been emerging in a variety of applications. TSV Stacking technology is used in DRAM, FPGA, wireless equipment and other applications, can enhance its performance and maintain low power consumption, thus gaining the favor of semiconductor plant and analog components factory, however, to accelerate the speed of TSV technology in the market, still need to rely on behalf of factories, IP vendors,   EDA plant and the plant to seal the work of cooperation. The previous article has analyzed how to apply the silicon perforation (TSV) to the stereo stacking of image sensors, power amplifiers and processors.

UFSC apply LabVIEW and Ni Compactdaq to acoustic beam forming of vehicle passing noise test

Acoustic image recognition of tires and exhaust noise at 50 km/h, 1,904.3 Hz "We have chosen a compact, DC-powered NI hardware that provides power to the microphone in the array. -Samir N. Gerges, the University of Santa Catarina (UFSC) Challenge: Develop a portable and affordable acoustic beamforming to identify noise sources through noise measurements and other applications. &n ...

High current Ihlp inductors for next-generation mobile devices

Electronic enthusiasts Network Core tip: A few days ago, Vishay announced the introduction of the 2020 outline size of the new Ihlp low height, high current inductor. The small size of the ihlp-2020ab-01 has 1.2mm of ultra-low altitude and low to 0.10μh sense values. The frequency range of the new Ihlp inductor is up to 5MHz, available for next-generation mobile devices, laptops, graphics cards, portable gaming consoles, personal navigation systems and personal multimedia devices, low altitude, high current power and load points (POL) converters, distributed power systems, and field programmable gate arrays ...

Move towards low frequency/multiple technology to integrate Wi-Fi application layout and expand

The power of Wi-Fi technology is growing. Mobile devices and the internet of things is booming, has driven more Wi-Fi applications, so the Wi-Fi Alliance is actively in the 2.4ghz/5ghz/60ghz of three-frequency fusion, as well as close wireless communication (NFC) and other heterogeneous networking technology integration direction,      It also plans to develop super Wi-Fi technology by using the Low-frequency white spectrum, which is dedicated to television broadcasts, to promote the formation of new opportunities for Wi-Fi diversification. From right to left is the Wi-Fi Alliance marketing Director ...

Free WiFi service will be terminated? It's not easy to get users to pay.

Recent news, according to foreign media reports, WiFi services are fast becoming a broadband service provider network strategy is an important component. But how long can the days of WiFi free be maintained? This is a huge question mark.   Network operators have hinted that they want to create more revenue from their WiFi network. Network operators want WiFi charges according to the latest statistics from market research firm Analysys Mason, more and more wireless and cable operators are now deploying WiFi networks. But many of them ...

Mr. Ballmer or the announcement this month of a major restructuring of Microsoft panic

Beijing Time June 24 news, according to foreign media reports, the U.S. Wall Street Journal's Science and Technology news site AllThingsD on 23rd quoted people familiar with the matter, Microsoft CEO Ballmer is brewing a major restructuring, will be informed by July 1 before the company executives, Microsoft is now a panic. The source said that in connection with the business and personnel reorganization, Mr. Ballmer was only consulted with a small group of senior executives, most of them directly reporting to him and some of the Microsoft Directors, ...

Freescale 12 axis Xtrinsic platform through Windows 8 requirements Certification

Freescale Semiconductor's 12-axis xtrinsic sensor assembly platform, with advanced sensor fusion capabilities, has been recognized by Microsoft and is compatible with portable devices using Windows 8 operating systems.   The solution was recently integrated into the new Ultra books and hybrid (hybrid) PC with Windows 8 operating systems and is expected to be announced later this quarter. ABI study estimates that MEMS-based sensors are used in intelligent portable devices (for example ...).

Zeus, US Letter (Maxim) Soc eyeing smart grid security

Electronic enthusiasts Network "compiling/david": The United States letter (Maxim) officially announced the introduction of a smart instrument for the SOC chip Zeus, can be embedded in the smart grid equipment, for measuring and connecting the safety of the equipment to fully escort. US letter says Zeus will support a variety of security and connectivity devices.   The chip has a built-in encryption module to protect communications, a secure boot loader, and prevent tampering with unauthorized modification of the firmware behavior and any physical attack meter will be accurately detected and automatically recorded and reported. Zeus Platform includes ...

Aifas launches the industry's most authentic LTE service Test flow scenario

UK Stevenage-November 29, 2012-AIFAS Holdings (Aeroflex LC Corp., NYSE: ARX) 's wholly owned subsidiary Aifas Limited (Aeroflex 2¥q) announced that the company's E500 The LTE functional test platform now supports a wide range of IP data Services. By adding end-to-end Data Services, the E500 industry-leading functional performance has been further perfected, providing network equipment providers and mobile network operators the most authentic in the marketplace ...

Agilent realizes wireless Test crossover, best Test product

Electronic enthusiasts Network: Yesterday (9.13), Agilent Technology at the Westin Shenzhen, held a "Agilent testing and Measurement conference." From wireless communications, RF, components and other fields of testing engineers a total of more than 400 people visited the event. The theme of this conference is "higher, faster and more flexible". The whole day's schedule was a keynote speech in the morning, describing some of Agilent's developments in equipment testing and new product recommendations, as well as a media conference in which the company introduced a wireless test proposal. In the afternoon, the organizers held a wireless communication test, the number of ...

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